On May 12, BYD announced that it planned to spin off its holding subsidiary BYD semiconductor to be listed on the gem of Shenzhen Stock Exchange.

The announcement said that after the spin off, BYD's ownership structure will not change, and will still maintain control over BYD semiconductor. BYD semiconductor's main business is the R & D, production and sales of power semiconductor, intelligent control IC, intelligent sensor and photoelectric semiconductor. Its main products include IGBT, SiC MOSFET, MCU, battery protection IC, AC-DC IC, CMOS image sensor, embedded fingerprint identification, electromagnetic and pressure sensor, LED light source, LED lighting, LED display, etc. According to the announcement, after the spin off, BYD semiconductor will continue to engage in the R & D, production and sales of power semiconductor, intelligent control IC, intelligent sensor and photoelectric semiconductor. In the future, BYD semiconductor will focus on vehicle specification semiconductor, simultaneously promote the development of semiconductor business in industries, household appliances, new energy, consumer electronics and other fields, and strive to become an efficient, intelligent and integrated new semiconductor supplier.

Meanwhile, BYD semiconductor maintains high independence from other businesses of the company. After the spin off, BYD remains the controlling shareholder of BYD semiconductor.

In 2020, BYD board semiconductor obtained a number of financing, including 1.9 billion yuan financing from Sequoia Capital, CICC capital, SDIC innovation and Himalayan capital in round a financing, and 800 million yuan financing from dozens of investment companies such as SK China, Xiaomi group, China Merchants Bank International Capital and Lenovo Group in round a + financing. The institutional valuation has exceeded 10 billion yuan.